http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H01138221-A

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filingDate 1987-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3b8e4400d275636814191a0911808fe
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publicationDate 1989-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H01138221-A
titleOfInvention Moisture-curable one-package epoxy resin composition and method for curing it
abstract PURPOSE: To obtain an one-pack epoxy resin compsn. having excellent storage stability and being curable at ordinary temp. an which is comprised of a polyepoxy compd. and a specified aminosilane compd. n CONSTITUTION: The title compsn. comprises a polyepoxy compd. having 2 or more epoxy groups in its molecule (e.g., bisphenol A glycidyl ether type epoxy resins, their deriv., etc.) and an aminosilane compd. having one or more N-Si bond in the molecule which can be easily hydrolyzed with moisture to regenerate a prim. or a sec. amine (which is obtd. by condensation of various alip., alicyclic or arom. prim. or sec. amine compd. and trimethylchlorosilane, e.g., a reaction of formula I or by condensation of the amine compd. and hexamethyl silazane, e.g., a reaction of formula II or III). The title compsn. has excellent storage stability, is cured with moisture in an atmosphere at ordinary temp. and is used for adhesives, paints, coating materials, sealing materials for electronic parts, etc. n COPYRIGHT: (C)1989,JPO&Japio
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