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filingDate 1987-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd47a18220b4fec0e59acc1668e62883
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publicationDate 1989-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H01104681-A
titleOfInvention Tape adhesive for spot welding
abstract PURPOSE: To obtain the title adhesive easily spreadable when pressed with an electrode chip and exhibiting strong adhesive force even to an oily steel plate, by using an epoxy resin and a rubber each having specific physical proper ties as main components. n CONSTITUTION: The objective adhesive contains (A) an epoxy resin having a solubility parameter (SP) of ≥9.6 (e.g. bisphenol A-type, cresol novolak-type, polyol-type resin or a resin modified with urethane polymer, etc.) and (B) a rubber having an SP value of ≤8.6 (e.g. styrene butadiene rubber, natural rubber or butyl rubber) as main components. The hardener for the component A is those stable at normal temperature and exhibiting activity at 160W220°C, e.g. dicyandiamide, dihydrazides or guanidines. n COPYRIGHT: (C)1989,JPO&Japio
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002294207-A
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