| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-40 |
| filingDate |
2018-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2023-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2023-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-7212301-B2 |
| titleOfInvention |
Resin composition, resin sheet, multilayer printed wiring board and semiconductor device |
| priorityDate |
2018-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |