| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 |
| filingDate |
2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-7196936-B2 |
| titleOfInvention |
Method for manufacturing wiring board for semiconductor device, and wiring board for semiconductor device |
| priorityDate |
2018-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |