http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7122570-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate | 2018-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-7122570-B2 |
| titleOfInvention | Thermosetting resin composition, prepreg, laminate and printed wiring board |
| priorityDate | 2018-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 57.