http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7066975-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate | 2017-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-7066975-B2 |
| titleOfInvention | Resin composition, resin sheet, circuit board and semiconductor chip package |
| priorityDate | 2017-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 237.