Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
filingDate |
2017-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2022-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-7039601-B2 |
titleOfInvention |
Copper electrodeposition in microelectronics |
priorityDate |
2016-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |