http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7019876-B1

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filingDate 2021-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-7019876-B1
titleOfInvention Surface-treated copper foil for printed wiring boards, and copper-clad laminates and printed wiring boards for printed wiring boards using this
abstract The surface-treated copper foil for a printed wiring board of the present invention is A surface-treated copper foil for a printed wiring board having a surface-treated film including a roughened-treated layer on which roughened particles are formed on at least one surface of the copper foil substrate, wherein the JIS Z is on the surface of the surface-treated film. The 20 degree mirror gloss Gs (20 °) of the TD measured according to 8741: 1997 is less than 0.8%, and the TD measured according to JIS Z 8741: 1997 on the surface of the surface treatment film. The 60-degree mirror surface gloss Gs (60 °) is 0.4% or more, and the 75-degree mirror surface gloss Gs (75 °) of TD measured in accordance with JIS Z 8741: 1997 on the surface of the surface-treated film. The mirror surface gloss ratio (Gs (45 °) / Gs (75 °)) of the 45 degree mirror surface gloss Gs (45 °) is 0.1 or more and 1.5 or less.
priorityDate 2020-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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