http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6978471-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2019-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6978471-B2 |
| titleOfInvention | Manufacturing method of multi-layer printed wiring board, resin film and multi-layer printed wiring board |
| priorityDate | 2018-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 92.