http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6950774-B1

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D75-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D73-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
filingDate 2020-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-6950774-B1
titleOfInvention Cover tape and packaging for electronic component packaging
abstract PROBLEM TO BE SOLVED: To provide a cover tape for packaging electronic components capable of suppressing unintentional peeling of a cover tape and improving mounting efficiency at the time of mounting even when a moist heat load is applied. SOLUTION: A base material layer 2, a heat seal layer 3 arranged on one surface side of the base material layer 2 and sealed by a carrier tape having a plurality of storage portions for storing electronic components, and the base material. The layer 2 has an antistatic layer 4 arranged on the surface opposite to the surface on the heat seal layer 3 side, and is stored in a moist heat environment at 40 ° C. and 95% RH for 100 hours. The surface resistivity of the surface on the side on which the antistatic layer 4 is arranged is 1.0 × 10 10 Ω / □ or less, the sealing strength with the carrier tape before the moist heat load is 0.7 N or less, and the above. A cover tape for packaging electronic components, characterized in that the sealing strength with the carrier tape after a moist heat load is 0.1 N or more. [Selection diagram] Fig. 1
priorityDate 2020-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID19262
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452859729
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415715486
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408847131
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5362119
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453194748
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21149510
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22993278
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID162071
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453874340
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448955503
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491540
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID61927
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419497099
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID22475649
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522604
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410555125
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28094
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420664686
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID453303310
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23273614
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9793819
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4421864
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID4756
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID408636244
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449334826
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14831
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID21871601

Total number of triples: 42.