http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6947998-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2020-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6947998-B1 |
| titleOfInvention | Flux and solder paste |
| abstract | PROBLEM TO BE SOLVED: To provide a flux and a solder paste capable of sufficiently suppressing heating dripping during reflow. A flux containing a rosin, a solvent, a thixotropic agent, and an activator is adopted. The thixo agent contains polyamide (PA2), and PA2 is composed of one or more selected from the group consisting of an aliphatic carboxylic acid and a hydroxy group-containing aliphatic carboxylic acid, and an aliphatic amine having 3 to 10 carbon atoms. It is a condensate. [Selection diagram] None |
| priorityDate | 2020-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 273.