http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6895131-B2

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29255
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3656
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2922
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02
filingDate 2019-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-6895131-B2
titleOfInvention Solder material for semiconductor devices
priorityDate 2015-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727

Total number of triples: 47.