| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2017-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-6858351-B2 |
| titleOfInvention |
Resin composition, resin sheet with support, multilayer printed wiring board and semiconductor device |
| priorityDate |
2016-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |