| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D161-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D177-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F7-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate |
2019-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-6855539-B2 |
| titleOfInvention |
Sintered paste composition for power semiconductor bonding |
| priorityDate |
2018-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |