http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6811416-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2016-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6811416-B2 |
| titleOfInvention | Resin composition for solder resist, film for solder resist, circuit board with solder resist layer, and package |
| priorityDate | 2015-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.