Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
2016-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2020-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-6776597-B2 |
titleOfInvention |
Thermosetting resin compositions, resin-sealed substrates, and electronic devices |
priorityDate |
2016-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |