http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6713864-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2016-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6713864-B2 |
| titleOfInvention | Method for manufacturing semiconductor chip and adhesive tape for temporarily fixing wafer |
| priorityDate | 2015-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.