http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6649597-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-08 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 |
filingDate | 2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2020-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2020-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-6649597-B1 |
titleOfInvention | Solder alloys, solder powders and solder joints |
abstract | An object of the present invention is to provide a solder alloy or the like which suppresses a temporal change of a solder paste, has a small temperature difference between a liquidus temperature and a solidus temperature and has high reliability. The solder alloy includes at least one of As: 10 mass ppm or more and less than 40 mass ppm, Bi: 0 to 10000 mass ppm, Pb: 0 to 5100 mass ppm, and Sb: 0 to 3000 mass ppm. The balance has an alloy composition of Sn and satisfies the formulas (1) and (2). 300 ≦ 3As + Sb + Bi + Pb (1), 0.1 ≦ {(3As + Sb) / (Bi + Pb)} × 100 ≦ 200 (2) [In the formulas (1) and (2), As, Sb, Bi, and Pb are alloys, respectively. It represents the content (mass ppm) in the composition. ] [Selection diagram] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021166967-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6849933-B1 |
priorityDate | 2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 203.