http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6643693-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-02 |
| filingDate | 2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6643693-B1 |
| titleOfInvention | Solder paste |
| abstract | An object of the present invention is to achieve soldering with less voids without impairing production efficiency and storage stability, and also have an effect of suppressing viscosity increase, excellent wettability, and a liquidus temperature and a solidus temperature. To provide a solder paste having a small temperature difference and high mechanical properties. A flux for soldering containing a resin, a glycol-based solvent and an organic acid ester; and As: 25 to 300 mass ppm, Pb: more than 0 mass ppm, 5100 mass ppm or less, and Sb: more than 0 mass ppm 3000 It has an alloy composition consisting of at least one of mass ppm or less and Bi: more than 0 mass ppm and 10,000 mass ppm or less, and the balance: Sn, and the following formulas (1) and (2): 275 ≦ 2As + Sb + Bi + Pb (1) 0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2) [In the above formulas (1) and (2), As, Sb, Bi, and Pb each represent the content (mass ppm) in the alloy composition] Solder alloy that satisfies; Including, solder paste. [Selection diagram] None |
| priorityDate | 2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 112.