Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-548 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098 |
filingDate |
2016-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2020-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-6627705-B2 |
titleOfInvention |
Thermosetting silicone resin composition, optical semiconductor device and semiconductor package using the molded product |
priorityDate |
2015-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |