http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6582850-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2015-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6582850-B2 |
| titleOfInvention | Adhesion improving material, wiring structure, manufacturing method thereof, semiconductor device, and manufacturing method thereof |
| priorityDate | 2015-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.