http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6471420-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate | 2014-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6471420-B2 |
| titleOfInvention | Epoxy resin composition, cured product, fiber reinforced composite material, fiber reinforced resin molded product, semiconductor sealing material, semiconductor device, prepreg, circuit board, buildup film, and buildup board |
| priorityDate | 2014-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 217.