http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6442722-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2014-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6442722-B2 |
| titleOfInvention | Electroplating type bump electrode forming method |
| priorityDate | 2014-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 425.