| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2014-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-6413437-B2 |
| titleOfInvention |
Wiring board manufacturing method and semiconductor package manufacturing method |
| priorityDate |
2014-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |