| abstract |
The objective of this invention is providing the resin hollow particle which has the outstanding pressure | voltage resistant performance, its manufacturing method, and an application. A resin hollow particle composed of an outer shell portion made of a thermoplastic resin and a hollow portion surrounded by the outer shell portion, wherein the thermoplastic resin has a polymerizable carbon-carbon double bond in one molecule. 0.6 to 3.0% by weight of a crosslinkable monomer having 2 or more in the above and 97 to 99.4% by weight of a non-crosslinkable monomer having one polymerizable carbon-carbon double bond in one molecule. %, The resin hollow particles contain a foaming agent, and the weight ratio of the organic compound having a vapor pressure at 25 ° C. exceeding 100 kPa in the foaming agent is 50 to 100% by weight. The resin hollow particles, wherein the encapsulating rate of the foaming agent is 3 to 13% by weight. |