| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 |
| filingDate |
2014-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2018-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-6277751-B2 |
| titleOfInvention |
Copper particle dispersion paste and method for producing conductive substrate |
| priorityDate |
2014-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |