Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2190-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-48 |
filingDate |
2013-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2017-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2017-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-6218083-B2 |
titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and method for producing semiconductor device |
priorityDate |
2012-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |