http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6106526-B2
Outgoing Links
Predicate | Object |
---|---|
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
filingDate | 2013-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2017-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2017-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-6106526-B2 |
titleOfInvention | Adhesive sheet for semiconductor wafer processing |
priorityDate | 2013-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.