patent/JP-6098908-B2

Predicate	Object
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
filingDate	2016-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2017-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-6098908-B2
titleOfInvention	Curable resin composition, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film
priorityDate	2016-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID466793431

Total number of triples: 18.