| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-3045 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2012-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-6062425-B2 |
| titleOfInvention |
Compositions for metal electroplating including additives for bottom-up filling of through-silicon vias and interconnect features |
| priorityDate |
2011-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |