http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6055029-B2
Outgoing Links
Predicate | Object |
---|---|
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate | 2015-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-6055029-B2 |
titleOfInvention | Photosensitive resin composition, solder resist composition and printed wiring board |
priorityDate | 2015-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 161.