http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6053386-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2012-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-6053386-B2 |
| titleOfInvention | Bonding method of electronic parts |
| priorityDate | 2012-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 143.