patent/JP-6004441-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6004441-B2

Outgoing Links

Predicate	Object
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1148 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27416 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-37001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3512 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3841 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27515 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1131 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17519 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-488 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9211 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11416 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K3-0623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-742 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	2013-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2016-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2016-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-6004441-B2
titleOfInvention	Substrate bonding method, bump forming method, and semiconductor device
priorityDate	2013-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419524988 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3468413

Total number of triples: 89.