http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5962834-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2015-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5962834-B1 |
| titleOfInvention | Resin composition, adhesive film and circuit member connection method |
| abstract | An adhesive film and a resin composition that can realize connection with a connecting metal with high reliability by improving heat resistance, and a circuit member that realizes highly reliable connection with a connecting metal. And a semiconductor device provided with a highly reliable connection structure. A resin composition according to the present invention includes a mounting substrate (first circuit member) including an upper surface (first surface) and terminals (first terminals), a lower surface (251) (second surface), and terminals. The bump electrode 3 (connection metal) provided on the terminal 242 is placed at a temperature lower than the melting point of the bump electrode 3 by being interposed between the semiconductor element 2 (second circuit member) provided with 242 (second terminal). A resin composition having a flux function, which is used when the terminal 14 and the terminal 242 are bonded to each other via the bump electrode 3 by pressing the terminal 14 and the terminal 242 while heating, a compound having a flux function, and tris (hydroxyphenyl) Including methane type epoxy resin. [Selection] Figure 3 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018141105-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7035320-B2 |
| priorityDate | 2015-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 200.