http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5887633-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate | 2014-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5887633-B1 |
| titleOfInvention | Manufacturing method of semiconductor piece |
| abstract | [Problem] To suppress the occurrence of defects due to the uniformity of adhesion in a process of expanding the interval between adjacent semiconductor pieces or a process of separating a semiconductor piece from a holding member. A method of manufacturing a semiconductor piece includes a step of forming a fine groove on a surface of a substrate, and a groove on a back surface having a width wider than the width of the fine groove by a rotating cutting member from the back surface of the substrate. And the step of attaching the holding member having the adhesive layer to the back side of the substrate after forming the groove on the back side, and the adhesion between the back side of the substrate and the holding member before attaching the holding member to the back side of the substrate. A step of increasing the uniformity of force, a step of extending the interval between adjacent semiconductor pieces by extending the holding member with the holding member attached to the back surface of the substrate, and a member holding the semiconductor piece in an expanded state And a step of separating from the. The step of improving the uniformity of the adhesion is dry cleaning S206 or the like. [Selection] Figure 7 |
| priorityDate | 2014-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 26.