http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5877940-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate | 2010-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2016-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5877940-B2 |
| titleOfInvention | Method for polishing a wafer with copper and silicon exposed on the surface |
| priorityDate | 2010-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 159.