http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5835528-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G14-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G14-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2014-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5835528-B1 |
| titleOfInvention | Polyarylene ether resin, method for producing polyarylene ether resin, curable resin material, cured product thereof, semiconductor sealing material, prepreg, circuit board, and build-up film |
| abstract | Polyarylene ether resin with excellent physical properties such as heat resistance, thermal decomposition resistance, moisture solder resistance, flame retardancy and dielectric properties in cured products and its production method, curable resin material and its cured product, semiconductor encapsulating material, prepreg A circuit board and a build-up film are provided. It has a polyarylene ether structure (α) in its molecular structure, at least one of the aromatic nuclei in the polyarylene ether structure (α) has a naphthalene skeleton, and in the polyarylene ether structure (α) At least one of the aromatic nuclei has the following structural formula (1) on the aromatic nuclei: (X and y are points of attachment to the aromatic nucleus and are bonded to adjacent carbon atoms.) Structural site represented by (β) or the following structural formula (2) (O * atom and C * atom in the formula are respectively bonded to adjacent carbon atoms of the aromatic nucleus represented by Ar 1. ) A polyarylene ether resin characterized by having a structural moiety (γ) represented by: |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016121267-A |
| priorityDate | 2014-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 277.