abstract |
The liquid solder resist composition includes a carboxyl group-containing resin, a photopolymerizable compound containing one or more compounds selected from the group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and an oxidation agent. Contains titanium. The photopolymerization initiator includes a bisacylphosphine oxide photopolymerization initiator, a first α-hydroxyalkylphenone photopolymerization initiator that is liquid at 25 ° C, and a second α-solid that is solid at 25 ° C. And a hydroxyalkylphenone photopolymerization initiator. |