http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5741971-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-19 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate | 2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2015-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5741971-B2 |
| titleOfInvention | Method for manufacturing metal-ceramic bonding circuit board |
| priorityDate | 2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.