patent/JP-5692201-B2

Predicate	Object
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L87-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate	2012-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2015-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-5692201-B2
titleOfInvention	Thermosetting resin composition, and prepreg, laminate and multilayer printed wiring board using the same
priorityDate	2009-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID467012345

Total number of triples: 19.