patent/JP-5647335-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5647335-B2

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K3-06
filingDate	2012-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2014-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2014-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-5647335-B2
titleOfInvention	Solder transfer substrate, method for manufacturing solder transfer substrate, and solder transfer method
priorityDate	2011-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H07336033-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1075043-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006114735-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009010302-A
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID448033196 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8307

Total number of triples: 57.