| Predicate |
Object |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2011-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2014-12-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-5633382-B2 |
| titleOfInvention |
Thermosetting resin composition and prepreg, laminate and multilayer printed wiring board using the same |
| priorityDate |
2011-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |