http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5577996-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-55 |
| filingDate | 2010-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5577996-B2 |
| titleOfInvention | Thermosetting resin composition and interlayer adhesive film for printed wiring board |
| priorityDate | 2010-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 278.