http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5546518-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 |
| filingDate | 2011-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5546518-B2 |
| titleOfInvention | Adhesive tape for grinding brittle wafer back surface and grinding method using the same |
| priorityDate | 2011-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.