| abstract |
Provided is a copper foil with a carrier capable of forming wiring finer than L / S = 20 μm / 20 μm, for example, fine wiring of L / S = 15 μm / 15 μm. A copper foil with a carrier comprising a copper foil carrier, an intermediate layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the intermediate layer, the intermediate layer being Ni After heating the copper foil with a carrier at 220 ° C. for 2 hours and then peeling off the ultrathin copper layer according to JIS C 6471, the surface of the intermediate layer side of the ultrathin copper layer is made of Ni. adhesion amount 5 [mu] g / dm 2 or more 300 [mu] g / dm 2 or less is a copper foil with a carrier. [Selection] Figure 1 |