http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5459590-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 |
| filingDate | 2009-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5459590-B2 |
| titleOfInvention | Photosensitive resin composition, polyimide resin film using the same, and flexible printed wiring board |
| priorityDate | 2008-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 214.