patent/JP-5413926-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5413926-B2

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
filingDate	2011-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2014-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2014-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-5413926-B2
titleOfInvention	Solder balls and electronic components for semiconductor mounting
priorityDate	2010-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006011204-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009248156-A
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419583196

Total number of triples: 62.