http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5379066-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2010-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5379066-B2 |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation |
| abstract | <P>PROBLEM TO BE SOLVED: To achieve a high Tg of a cured product and good moldability and also high flame retardancy without blending a flame retardant such as a halogen compound or an antimony compound. <P>SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler, wherein (Aa) a phenol aralkyl type epoxy resin and (Ab) an o-cresol novolac type epoxy resin are blended, as the epoxy resin (A), each in a range of 20-80 mass% of the total amount of the epoxy resin (A), and a biphenyl type phenolic resin is blended as the curing agent (B) in a range of 40-100 mass% of the total amount of the curing agent (B). <P>COPYRIGHT: (C)2012,JPO&INPIT |
| priorityDate | 2010-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.