http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5376255-B2

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filingDate 2010-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-5376255-B2
titleOfInvention Firing type conductive copper paste
abstract <P>PROBLEM TO BE SOLVED: To provide a calcination type conductive copper paste which has a novel structure, can be sintered at a low temperature, and enables the manufacturing of a thick calcination type conductor film having a high adhesion to a substrate surface and a high conductivity on condition that a temperature within a range of 350-450&deg;C is selected as its calcination process temperature. <P>SOLUTION: The calcination type conductive copper paste comprises: copper powder having an average particle size of 10-2 &mu;m; fine copper powder having an average particle size of 1-0.2 &mu;m; powdered glass frit having an average particle size of 1.4-0.2 &mu;m, and a softening point of 300-400&deg;C; a dispersant; an organic binder; and a dispersion solvent. In a calcination process, the calcination type conductor is manufactured by a combination of: an oxidization process for removing the dispersant and the organic binder by heating the paste to a temperature of 350-450&deg;C in an air atmosphere; and a reduction process for reducing and removing an oxide coating on the surface of the fine copper powder, and sintering the copper powder and the fine copper powder, by heating the paste to a temperature of 350-450&deg;C in a reductive atmosphere containing hydrogen gas. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020132631-A1
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type http://data.epo.org/linked-data/def/patent/Publication

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