http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5370333-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2383-04 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| filingDate | 2010-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-5370333-B2 |
| titleOfInvention | Low thermal expansion thermosetting resin composition and resin film |
| abstract | The invention relates to a thermosetting resin composition comprising: a binder containing a thermosetting resin having a storage elastic modulus of 1,000 MPa or less at 20 DEG C and an elongation of 10% or more at 20 DEG C; and an inorganic filler in an amount of 100 to 2,000 parts by weight with respect to 100 parts by weight of the binder. According to the invention, it provides a thermosetting resin composition and resin film which have a low thermal expansion coefficient and able to possess a low elastic modulus, a high extensibility, and a low thermal expansion coefficient. |
| priorityDate | 2001-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 101.